ARM

Ames core board, with strong compatibility, can fully support all Ames controller functions.

The core board adopts DIP packaging mode, which provides convenient and efficient development experience for developers and helps to promote development work smoothly

ARM

model	Internet port	COM	CAN	SDIO	GPIO	power supply	encapsulation	Order No
ARM	1	3	2	1	7	DC5V	DIP40*40mm	ARM-0

Feature

Cloud platform:

Support Ames cloud platform

Flexibility:

Support interface and graphical programming

Scalability:

3-way serial port, 1-way network port, 1-way SDI0, 2-way CAN port

Multi protocol support:

modbusRTU、modbusTCP、OPC UA、IEC61850、IEC104、MQTT、 BACnet、Custom and other protocols

Small size:

40*40*10mm

Flexible installation:

DIP (2.0 row needle)

Harsh environment:

working temperature －25~75°C

Applicable scenarios:

Buildings, chemicals, pharmaceuticals, electricity, building materials, oil and gas, food, etc

Applicable scenarios

Smart transportation

Intelligent Security

new energy

Smart home

Smart agriculture

Intelligent power distribution